欧盟RoHS指令豁免项

　　由于技术问题，有部分材料或者产品的制造技术还做不到ROHS指令要求，在经过向欧盟的特殊申请后，以下项目可以获得豁免（部分豁免是有期限的）：

　　RoHS ExemptionsEU RoHS
　　Items Exemption Clauses
　　1 Mercury in compact fluorescent lamps not exceeding 5 mg per lamp
　　2 Mercury in straight fluorescent lamps for general purposes not exceeding:
　　- halophosphate 10 mg
　　- triphosphate with normal lifetime 5 mg
　　- triphosphate with long lifetime 8 mg.
　　3 Mercury in straight fluorescent lamps for special purposes.
　　4 Mercury in other lamps not specifically mentioned in this Annex.
　　5 Lead in glass of cathode ray tubes, electronic components and fluorescent tubes.
　　6 Lead as an alloying element in steel containing up to 0.35% lead by weight, aluminium containing up to 0.4% lead by weight and as a copper alloy containing up to 4% lead by weight.
　　7 – lead in high melting temperature type solders (i.e. lead-based alloys containing 85 % by weight or more lead)
　　- lead in solders for servers, storage and storage array systems, network infrastructure equipment for switching, signalling, transmission as well as network management for telecommunications
　　- lead in electronic ceramic parts (e.g. piezoelectronic devices).
　　8 Cadmium and its compounds in electrical contacts and cadmium plating except for applications banned under Directive 91/338/EEC (1) amending Directive 76/769/EEC (2) relating to restrictions on the marketing and use of certain dangerous substances and preparations
　　9 Hexavalent chromium as an anti-corrosion of the carbon steel cooling system in absorption refrigerators.
　　10 Lead used in compliant pin connector systems
　　11 Lead as a coating material for the thermal conduction module c-ring
　　12 Lead and cadmium in optical and filter glass
　　13 Lead in solders consisting of more than two elements for the connection between the pins and the package of microprocessors with a lead content of more than 80% and less than 85% by weight
　　14 Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages
　　15 DecaBDE in polymeric applications
　　16 Lead in lead-bronze bearing shells and bulbs
　　17 Lead in linear incandescent lamps with silicate coated tubes
　　18 Lead halide as radiant agent in High Intensity Discharge (HID) lamps used for professional reprography applications
　　19 Lead as activator in the fluorescent powder (1% lead by weight or less) of discharge lamps when used as sun tanning lamps containing phosphors such as BSP (BaSi2O5:Pb) as well as when used as specially lamps for diazo-printing reprography, lithography, insect traps, photochemical and curing processes containing phosphors such as SMS ((Sr,Ba)2MgSi2O7:Pb)
　　20 Lead with PbBiSn-Hg and PbInSn-Hg in specific compositions as main amalgam and with PbSn-Hg as auxiliary amalgam in very compact Energy Saving Lamps (ESL)
　　21 Lead oxide in glass used for bonding front and rear substrates of flat fluorescent lamps used for Liquid Crystal Displays (LCD)
　　22 Lead and cadmium in printing inks for the application of enamels on borosilicate glass.
　　23 Lead as impurity in RIG (rare earth iron gamet) Faraday rotators used for fibre optic communication systems.
　　24 Lead in finishes of fine pitch components other than connectors with a pitch of 0.65mm or less with NiFe lead frames and lead in finishes of fine pitch components other than connectors with a pitch of 0.65mm or less with coppler lead frames.
　　25 Lead in solders for the soldering to machined through hole discoidal and planar array ceramic multilayer capacitors.
　　26 Lead oxide in plasma display panels (PDP) and surface conduction electron emitter displays (SED) used in structural elements, notably in the front and rare glass dielectric layer, the bus electrode, the black stripe, the address electrode, the barrier ribs, the seal frit and frit ring as well as in print pastes.
　　27 Lead oxide in the glass envelope of Black Light Blue (BLB) lamps.
　　28 Lead alloys as solder for transducers used in high-powered (designated to operate for several hours at acoustic power levels of 125 dB SPL and above) loudspeakers.
　　29 Hexavalent chromium in corrosion preventive coatings of unpainted metal sheetings and fasterners used for corrosion protection and Electromagnetic Interference Shielding in equipment falling under category three of Directive 2002/96/EC (IT and telecommunications equipment). Exemption granted until 1 July 2007.
　　30Lead bound in crystal glass as defined in Annex I (Category 1,2,3 and 4) of Council Directive 69/493/EEC
　　2009年6月11日，欧盟OJ刊登了2009/443/EC，新增了6项RoHS指令的豁免，分别如下：
　　33. Lead insolders for the soldering of thin copper wires of 100 μm diameter andless in power transformers. 电力变压器中直径100微米及以下细铜线所用焊料中的铅
　　34. Lead in cermet-based trimmer potentiometer elements. 金属陶瓷质的微调电位计中的铅
　　35. Cadmium in photoresistors for optocouplers applied in professionalaudio equipment until 31 December 2009.2009年12月31日前专业音频设备的光耦合器中使用的光敏电阻的镉
　　36. Mercury used asa cathode sputtering inhibitor in DC plasma displays with a content upto 30 mg per display until 1 July 2010. 2010年7月1日前直流等离子显示器中阴极溅射抑制剂中的汞，其含量不得超过30毫克/显示器
　　37. Lead in the plating layer of high voltage diodes on the basis of a zinc borate glass body. 以硼酸锌玻璃体为基础的高压二极管的电镀层的铅
　　38. Cadmium and cadmium oxide in thick film pastes used on aluminium bonded beryllium oxide. 用氧化铍连接铝制成的厚膜浆料中镉和氧化镉


　　此前，在6月5日，欧盟还刊登了2009/428/EC，从2011年1月1日起，将原豁免的第22点“光纤通讯系统稀土铁石榴石法拉第旋转器中作为杂质的铅”从豁免列表中移除。


　　其实rohs一直都有在增加豁免条例。